FIRST STEPS
(basic checklist)
1. CHARACTERIZE AND UNDERSTAND YOUR SUBSTRATE Establishing any unique requirements and tolerances of a specific application's substrate will tend to save time and money when this characterization occurs before physical prototyping or assessing an optimum thin film process. Substrate geometry and physical composition frequently place fundamental restrictions as to which thin film processes are physically compatible or practical. Also, if the substrate includes unique features, surface morphology, or uniquely tight (or loose) tolerance requirements, this can also be a factor in determining which, of the compatible process options identified, will provide the best results in the intended application. 2. MAKE AN INITIAL, BEST-EFFORT SPECIFICATION DOCUMENT As with any fabrication work, having a documented specification is critical to communicating the desired outcome in thin film work, both within and outside one's organization. Providing a best-effort documentation of all needed coating properties -- dimensional, optical, electronic, environmental/reliability, compositional, tribilogical, etc -- will streamline communications considerably, even if many details of the thin film requirements are still unknown. 3. UNDERSTAND YOUR CONFIDENTIALITY REQUIREMENTS Confidentiality is both far more readily maintained and entirely more definitively controlled in Helicon's development services than what is possible in a forward-looking capital purchase agreement for (contractor-supported) custom process equipment that also includes a development burden. The latter scenario inevitably results in unintended consequences. While confidentiality agreements tend to contain some common clauses, we see large variations in such documents, particularly from start-ups that may not have a legal department. We have suggestions and stated policies for maintaining confidentiality in your thin film product development. Please read our policies: Here.
4. ESTABLISH WELL-INFORMED PROCESSING OPTIONS BEFOREHAND Product development in vacuum-deposited thin film components can be, and frequently has been, expensive and wasteful, due to premature process trajectories being chosen, based upon an avoidable lack of awareness/understanding of the very materials-specific differences between competing thin film process approaches and equipment configurations. With regard to the effort of obtaining the best available process information up-front, the history of thin film product development repeatedly demonstrates that the risk of being excessively thorough in this formative effort is a risk that is well worth taking. |