FACILITIES

• 8,500 sq ft facility w staging, fabrication, conference, and clean-room areas

• multiple load-locked source and deposition chambers

  • • • diverse plasma reactive capabilities/geometries/power-conditioning

      • large selection of vapor sources & types 

      • reactive magnetron/activated evaporation/dual-electron-beam, etc.

      • large target/source material selection in-house

      • lithography/photo-chemical processing

      • 3D-CAD design & FEA & MacLeod software & multiphysics

      • deposition chambers for wafers, cylinders, rods, and pellicles.

      • flexible process formats

      • full machine shop/surfacing

      • optical grinding/polishing/interferometry/profilometry facilities

      • diffusion/vacuum/test furnaces (w/controlled environment/vacuum/EC test-cells)

      • metrology/profilometry

      • wide microscopy capabilities

      • spectroscopy (large substrates capability); 

      • VUV/UV/VIS/NIR/MIR/plasma spectroscopy

      • critical cleaning facilities

      • x-ray analysis/XRD